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Drawing No. EH–MT–010 // Engineering Materials

Copper Properties

Reviewed August 2026

C11000 ETP copper is the common high-conductivity copper reference. Its thermal and electrical conductivity are exceptional, while mechanical strength depends strongly on temper and cold work.

C11000 electrolytic tough-pitch (ETP) copperCopperReference data — verify design allowables

Representative properties

Switch units without changing the underlying material reference.

Density
8,910 kg/m³
Representative reference value / range
Young’s modulus
117 GPa
Representative reference value / range
Poisson ratio
0.328
Representative reference value / range
Yield strength
70–210 MPa
Representative reference value / range
Tensile strength
220–300 MPa
Representative reference value / range
Thermal conductivity
391 W/(m·K)
Representative reference value / range
Specific heat
385 J/(kg·K)
Representative reference value / range
Thermal expansion
16.9 µm/(m·K)
Representative reference value / range
Melting / transition temperature
1,065–1,083 °C
Representative reference value / range
Why this basis matters: Copper strength cannot be quoted honestly without temper. The overview therefore shows a broad practical strength band while keeping the physical-property values tied to C11000.

What changes these properties?

Engineering variability

  • Annealed copper is soft and ductile; cold-worked tempers raise yield and tensile strength substantially.
  • The displayed Poisson ratio is derived from the CDA room-temperature Young’s and shear moduli.
  • Thermal conductivity is strongly temperature- and purity-dependent.
  • C11000 melts over a narrow solidus–liquidus range rather than at one exact temperature.

Selection note

Excellent for electrical conductors, heat exchangers, busbars and thermal spreaders. Mass, cost, softness and galvanic interactions may govern in structural applications.

Do not combine strength from one grade/condition with modulus, thermal data or temperature limits from another without checking compatibility. Where the overview shows a range, it is intended to expose variability—not establish allowable bounds.

Property interpretation

Stiffness vs strength

Young’s modulus controls elastic deformation. Yield or fracture strength controls how far the material can be stressed. These are separate material characteristics.

Thermal response

Thermal conductivity controls temperature gradients, specific heat contributes to thermal inertia, and expansion controls thermally induced strain when movement is restrained.

Temperature transition

The final property card is deliberately labeled “melting / transition.” Metals often have a solidus–liquidus range; amorphous polymers and glass use softening or glass-transition concepts; concrete and wood decompose instead of exhibiting one clean melt point.

Technical sources

Source hierarchy favors manufacturers, industry associations, standards bodies and government engineering references. Strength data must still be reconciled with the exact procurement specification.

Related materials

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